3-Inch Diameter Diamond Wafer Mechanical Polishing Device 1 Set

  Address - Japan

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 95697241

  Document Type - Tender Notices

Description - Description: Tender announcementThe following is subject to public competitive bidding.October 16, 2024President, Saga University, National University Corporation, Kodama Hiroaki◎Procurement agency number: 415 ◎Location number: 41○No. 81. Procu rement details⑴ Item classification number: 26⑵ Purchasing item and quantity1 set of 3-inch diameter diamond wafer mechanical polishing device⑶ Characteristics of procurement item, etc.: See bidding instructions.⑷　Delivery deadline: March 31, 2025⑸　Delivery location: Faculty of Science and Engineering, Saga University⑹　Bidding method: When deciding on the successful bid, the successful bid price will be the amount stated in the

Gt Ref Id - 95697241

Deadline - Oct 31, 2024