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4H-Sic Silicon Carbide (Sic) Integrated Circuit Processing On 100 Mm Diameter Sic Wafers

NATIONAL AERONAUTICS AND SPACE ADMINISTRATION United States has Released a tender for 4H-Sic Silicon Carbide (Sic) Integrated Circuit Processing On 100 Mm Diameter Sic Wafers in Consultancy. The tender was released on Apr 12, 2025.

Country - United States

Summary - 4H-Sic Silicon Carbide (Sic) Integrated Circuit Processing On 100 Mm Diameter Sic Wafers

Deadline - Apr 21, 2025

GT reference number - 106866089

Product classification - Research and development consultancy services

Organization Details:

  Address - United States

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 106866089

  Document Type - Tender Notices

Notice Details and Documents:

Description - Description: NASA Glenn Research (GRC) is hereby soliciting information from potential sources for fabrication of particular integrated SiC device structures (JFETs and resistors) via a particular fabrication process flow to the desired specification s on NASA-provided 100 mm diameter 4H-SiC epilayered wafers using NASA-provided device-layout design files. The National Aeronautics and Space Administration (NASA) GRC is seeking capability statements from all interested parties, including all socioeconomic categories of Small Businesses and Historically Black Colleges and Universities (HBCU)/Minority Institutions (MI) for the purposes of determining the appropriate level of competition and/or s

Gt Ref Id - 106866089

Deadline - Apr 21, 2025

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