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4H-Sic Silicon Carbide (Sic) Integrated Circuit Processing On 100 Mm Diameter Sic Wafers

NATIONAL AERONAUTICS AND SPACE ADMINISTRATION United States has Released a tender for 4H-Sic Silicon Carbide (Sic) Integrated Circuit Processing On 100 Mm Diameter Sic Wafers in Consultancy. The tender was released on Apr 24, 2025.

Country - United States

Summary - 4H-Sic Silicon Carbide (Sic) Integrated Circuit Processing On 100 Mm Diameter Sic Wafers

Deadline - Apr 29, 2025

GT reference number - 107559732

Product classification - Research and development consultancy services

Organization Details:

  Address - United States

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 107559732

  Document Type - Tender Notices

Notice Details and Documents:

Description - Description: Amendment 1: Extending Sources Sought notice response deadline to 4/29/2025 at 5:00pm ET. NASA Glenn Research (GRC) is hereby soliciting information from potential sources for fabrication of particular integrated SiC device structures (J FETs and resistors) via a particular fabrication process flow to the desired specifications on NASA-provided 100 mm diameter 4H-SiC epilayered wafers using NASA-provided device-layout design files. The National Aeronautics and Space Administration (NASA) GRC is seeking capability statements from all interested parties for the purposes of determining the appropriate level of competition and/or small business subcontracting goals for 4H-SiC Silicon

Gt Ref Id - 107559732

Deadline - Apr 29, 2025

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