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A Full Set Of Prototype Cmos Silicon-Based Wafers For High-Speed Mram Test Chip Development

国立大学法人 Japan has Released a tender for A Full Set Of Prototype Cmos Silicon-Based Wafers For High-Speed Mram Test Chip Development in Energy, Power and Electrical. The tender was released on Mar 21, 2025.

Country - Japan

Summary - A Full Set Of Prototype Cmos Silicon-Based Wafers For High-Speed Mram Test Chip Development

Deadline - Apr 05, 2025

GT reference number - 105451247

Product classification - Electrical machinery, apparatus, equipment and consumables; lighting

Organization Details:

  Address - Japan

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 105451247

  Document Type - Tender Notices

Notice Details and Documents:

Description - Description: Bid announcementGeneral competitive bids are included as follows:March 21st, 2025Izu Hitoshi, Vice President of Tohoku University, National University Corporation◎Procurement agency number: 415 ◎Location number: 04○No. 2291. Procur ement details⑴ Item classification number 262) Purchasing Subject and Quantity: A full set of prototype CMOS silicon-based wafers for high-speed MRAM test chip development⑶Specifications of procurement projects, etc. according to the bidding instructions.⑷ Delivery deadline: March 31, 2026⑸ Delivery location: Tohoku University International Accumulated Electronics Research and Development Center⑹ Same as No. 228.2. Eligibility for parti

Gt Ref Id - 105451247

Deadline - Apr 05, 2025

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