Acquisition Of A Chemical-Mechanical Planarization Equipment For Semiconductor Wafers

  Address - Spain

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 102815455

  Document Type - Tender Notices

Description - Description: The acquisition of this equipment would provide these capabilities, which would represent an important competitive advantage both internally at the institute and at the same time offer a more complete service to external users, both rese arch groups and companies. Having a nanometric level Chemical Mechanical planarization tool would increase the services offered, covering applications required in the semiconductor field (face polishing for coupling and layer planarization in multilayer and multi-wafer devices). It would also facilitate access by the institute's research groups to competitive research projects, which is currently hampered by the lack of this type of equipment. Th

Gt Ref Id - 102815455

Deadline - Feb 21, 2025