Beihang University School Of Integrated Circuit Science And Engineering 3Dx-Ray Detection And Analysis System For Nondestructive Detection Of Micro-Defects In Chips And Pcbs Bidding Announcement

北京航空航天大学集成电路科学与工程学院 China has Released a tender for Beihang University School Of Integrated Circuit Science And Engineering 3Dx-Ray Detection And Analysis System For Nondestructive Detection Of Micro-Defects In Chips And Pcbs Bidding Announcement in laboratory equipment and services . The tender was released on Nov 19, 2024.

Country - China

Summary - Beihang University School Of Integrated Circuit Science And Engineering 3Dx-Ray Detection And Analysis System For Nondestructive Detection Of Micro-Defects In Chips And Pcbs Bidding Announcement

Deadline - Dec 12, 2024

GT reference number - 97825390

Product classification - Laboratory, optical and precision equipments (excl. glasses)