Chongqing Xinlian Microelectronics Co., Ltd. Wafer Storage Box (Foup) And Mask Transfer Box (Rsp) Procurement Project - International Bidding Announcement (1)

Name: Chongqing Xinlian Microelectronics Co., Ltd. Wafer Storage Box (Foup) And Mask Transfer Box (Rsp) Procurement Project - International Bidding Announcement (1)
Start: 2024-12-11
End: 2025-01-02
Location: Chongqing Xinlian Microelectronics Co., Ltd.

Chongqing Xinlian Microelectronics Co., Ltd. China has Released a tender for Chongqing Xinlian Microelectronics Co., Ltd. Wafer Storage Box (Foup) And Mask Transfer Box (Rsp) Procurement Project - International Bidding Announcement (1) in Infrastructure and construction. The tender was released on Dec 11, 2024.

Country - China

Summary - Chongqing Xinlian Microelectronics Co., Ltd. Wafer Storage Box (Foup) And Mask Transfer Box (Rsp) Procurement Project - International Bidding Announcement (1)

Deadline - Jan 02, 2025

GT reference number - 99510064

Product classification - Construction work

Organization Details:

Address - China

Contact details - 565656565

Tender notice no. - 76454545

GT Ref Id - 99510064

Document Type - Tender Notices

Notice Details and Documents:

Description - Description: Chongqing Xinlian Microelectronics Co., Ltd. Wafer Storage Box (FOUP) and Mask Transfer Box (RSP) Procurement Project - International Bidding Announcement (1)local title:: 重庆芯联微电子有限公司硅片储存盒(FOUP)和掩模� �传送盒（RSP）采购项目 - 国际招标公告(1)Document Fee: : ￥3000/$450

Gt Ref Id - 99510064

Deadline - Jan 02, 2025

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