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Cryogenic Microsystems Thermal Packaging Rfi + Workshop Special Notice

DEPT OF DEFENSE United States has Released a tender for Cryogenic Microsystems Thermal Packaging Rfi + Workshop Special Notice in Infrastructure and construction. The tender was released on Nov 16, 2024.

Country - United States

Summary - Cryogenic Microsystems Thermal Packaging Rfi + Workshop Special Notice

Deadline - login to view

GT reference number - 97713143

Product classification - Construction work

Organization Details:

  Address - United States

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 97713143

  Document Type - Tender Notices

Notice Details and Documents:

Description - Description: The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) seeks information on new approaches and technologies for thermal packaging of cryogenic microsystems from 10 mK to 77 K, and the associated interc onnects between these temperatures, as well as to room temperature microsystems. DARPA will also host an in-person workshop to explore the current state-of-the-art (SOA) and emerging approaches and technologies for cryogenic microsystems packaging in the range of 10 mK to 77 K. The workshop will be held on December 2, 2024, at Booz Allen Hamilton, 8283 Greensboro Drive, McLean, VA 22102 from 8:00 a.m. to 5:00 p.m. ET.local title:: Cryogenic Micro

Gt Ref Id - 97713143

Deadline - Nov 18, 2024

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