Delivery And Installation Of A Tool For Sub-Micron Accuracy Flip-Chip Bonding

Name: Delivery And Installation Of A Tool For Sub-Micron Accuracy Flip-Chip Bonding
Start: 2024-12-27
End: 2025-01-27
Location: Universiteit Gent

Universiteit Gent Belgium has Released a tender for Delivery And Installation Of A Tool For Sub-Micron Accuracy Flip-Chip Bonding in Technology Hardware and Equipment. The tender was released on Dec 27, 2024.

Country - Belgium

Summary - Delivery And Installation Of A Tool For Sub-Micron Accuracy Flip-Chip Bonding

Deadline - Jan 27, 2025

GT reference number - 100578282

Product classification - Microelectronic machinery and apparatus and microsystems

Organization Details:

Address - Belgium

Contact details - 565656565

Tender notice no. - 76454545

GT Ref Id - 100578282

Document Type - Tender Notices

Notice Details and Documents:

Description - Description: DELIVERY AND INSTALLATION OF A TOOL FOR SUB-MICRON ACCURACY FLIP-CHIP BONDINGlocal title:: DELIVERY AND INSTALLATION OF A TOOL FOR SUB-MICRON ACCURACY FLIP-CHIP BONDINGContract Duration: : 180 DAYContract Type: : Supplylocal description: : DELIVERY AND INSTALLATION OF A TOOL FOR SUB-MICRON ACCURACY FLIP-CHIP BONDING dispatch_date: 2024-12-23 00:00:00 lot_details: 1: DELIVERY AND INSTALLATION OF A TOOL FOR SUB-MICRON ACCURACY FLIP-CHIP BONDING

Gt Ref Id - 100578282

Deadline - Jan 27, 2025

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