Drie Etch Cluster (Mainframe + 3 Chambers) (Ipms-Mrs07.1; Ipms-Mrs07.2; Ipms-Mrs08.1; Ipms-Mrs08.2) (Pr882587-2480-P)

  Address - Germany

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 106899785

  Document Type - Tender Notices

Description - Description: Description: 1 piece of drie etch cluster (mainframe+3 chambers):IPMS-MRS07.1: Etching mainframeIPMS-MRS07.2: DRIE ETCHING Chamber (Kammer1 for deep silicon sentences)IPMS-MRS08.1: Etching modules that is integrated into the mainframe MR S07 (chamber 2 for the oxide sets of thick hard masks)IPMS-MRS08.2: ICP ETCHING Module that is integrated into the MainFrame MRS07 (Chamber 3 for Nitrid and Poly-SI etching with high selectivity for SIO2)Optional service positions:5.7 Cassette/wafer specifications Processing of quartz wafers in accordance with the specifications mentioned above yes/no7.2 Extended guarantee An extension of the warranty by another 12 months should be offered. Durin

Gt Ref Id - 106899785

Deadline - May 12, 2025