Eswin Board Level Packaging System Integrated Circuit Project - International Tender Announcement (2)

Name: Eswin Board Level Packaging System Integrated Circuit Project - International Tender Announcement (2)
Start: 2025-01-22
End: 2025-02-14
Location: Chengdu Yicheng Integrated Circuit Co., Ltd.

Chengdu Yicheng Integrated Circuit Co., Ltd. China has Released a tender for Eswin Board Level Packaging System Integrated Circuit Project - International Tender Announcement (2) in Energy, Power and Electrical. The tender was released on Jan 22, 2025.

Country - China

Summary - Eswin Board Level Packaging System Integrated Circuit Project - International Tender Announcement (2)

Deadline - Feb 14, 2025

GT reference number - 101978447

Product classification - Electrical machinery, apparatus, equipment and consumables; lighting

Organization Details:

Address - China

Contact details - 565656565

Tender notice no. - 76454545

GT Ref Id - 101978447

Document Type - Tender Notices

Notice Details and Documents:

Description - Description: Eswin Board Level Packaging System Integrated Circuit Project - International Tender Announcement (2)local title:: 奕斯伟板级封装系统集成电路项目 - 国际招标公告(2)Document Fee: : ￥5000/$850 Global Tenders is not only confined to tenders but we also upload crucial information, from future prospects to past market records.

Gt Ref Id - 101978447

Deadline - Feb 14, 2025

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