Eswin Board Level Packaging System Integrated Circuit Project - International Tender Announcement (2)

Name: Eswin Board Level Packaging System Integrated Circuit Project - International Tender Announcement (2)
Start: 2024-08-27
End: 2024-09-12
Location: Chengdu Yicheng Integrated Circuit Co., Ltd.

Chengdu Yicheng Integrated Circuit Co., Ltd. China has Released a tender for Eswin Board Level Packaging System Integrated Circuit Project - International Tender Announcement (2) in Energy, Power and Electrical. The tender was released on Aug 27, 2024.

Country - China

Summary - Eswin Board Level Packaging System Integrated Circuit Project - International Tender Announcement (2)

Deadline - Sep 12, 2024

GT reference number - 91512042

Product classification - Electrical machinery, apparatus, equipment and consumables; lighting

Organization Details:

Address - China

Contact details - 565656565

Tender notice no. - 76454545

GT Ref Id - 91512042

Document Type - Tender Notices

Notice Details and Documents:

Description - Description: Eswin Board Level Packaging System Integrated Circuit Project - International Tender Announcement (2)notice_title: Eswin Board Level Packaging System Integrated Circuit Project - International Tender Announcement (2)document_fee: ￥3000 /$500local title:: 奕斯伟板级封装系统集成电路项目 - 国际招标公告(2)

Gt Ref Id - 91512042

Deadline - Sep 12, 2024

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