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Flipchip Bonding

ENERGY, DEPARTMENT OF United States has Released a tender for Flipchip Bonding in Energy, Power and Electrical. The tender was released on Apr 10, 2025.

Country - United States

Summary - Flipchip Bonding

Deadline - Apr 24, 2025

GT reference number - 106715777

Product classification - Electronic components

Organization Details:

  Address - United States

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 106715777

  Document Type - Tender Notices

Notice Details and Documents:

Description - Description: SLAC National Accelerator Laboratory is operated by Stanford University for the Department of Energy. As a management and operating contractor, subcontracts awarded by the Laboratory are not Federal procurements, and are not directly sub ject to the Federal Acquisition Regulations in 48 CFR. Nonetheless, certain Federal laws, Executive Orders, and regulations may affect our DOE approved purchasing system, as required by statute, regulation, or contract terms and conditions. This is a formal request for quotation from Procurement as requirement has been assigned to me as a buyer. **Please do not contact the requester regarding the item(s) in this request while we are in the proces

Gt Ref Id - 106715777

Deadline - Apr 24, 2025

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