Hpcmp Technical Insertion Boa On Ramp Opportunity

  Address - United States

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 19312175

  Document Type - Tender Notices

Description - Description: The US Army Corps of Engineers Research and Development Center (ERDC) is conducting market research for the on-ramping of additional firms to the High Performance Computing Modernization Program (HPCMP) Basic Ordering Agreeement (BOA) in support of Technical Insertion (Tl) requirements at its DoD Supercomputing Resource Centers (DSRCs). ERDC is requesting interested firms to submit a capabilities package in response to this announcement for review of possible market capabilities to perform its Tl requirements. The description of the work is provided below which also will include the delivery, assembly, acceptance testing of a fully operational system, system administration (if r

Gt Ref Id - 19312175

Deadline - Aug 13, 2024