Icp Etching System

  Address - Germany

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 99964830

  Document Type - Tender Notices

Description - Description: A system for reactive ion etching using inductively coupled plasma (ICP-RIE) is being advertised. The system is to be a core part of the wafer processing infrastructure and will be installed in the clean room of the University of Paderbo rn. The development of wafer-scale components places great demands on the wafer size (up to 8 inches), the structure size and the structure homogeneity. The optical components used are based on waveguide structures that place extremely high demands on the structure homogeneity and side roughness. Rib waveguides are to be etched over a length of several millimeters with a high degree of homogeneity.local title:: ICP-ÄtzanlageContract Duration: :

Gt Ref Id - 99964830

Deadline - Jan 16, 2025