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Nmis Power Electronics Advanced Packaging Semiconductor Facility - Wafer Mount Equipment

University of Strathclyde United Kingdom has Released a tender for Nmis Power Electronics Advanced Packaging Semiconductor Facility - Wafer Mount Equipment in laboratory equipment and services . The tender was released on May 24, 2024.

Country - United Kingdom

Summary - Nmis Power Electronics Advanced Packaging Semiconductor Facility - Wafer Mount Equipment

Deadline - May 23, 2025

GT reference number - 82151896

Product classification - Laboratory, optical and precision equipments (excl. glasses)

Organization Details:

  Address - United Kingdom

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 82151896

  Document Type - Tender Notices

Notice Details and Documents:

Description - Description: NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The focus of this procurement activity to acquire wafer mount equipment.additional_tender_url: http://www.strath.ac.uk/dispatch_date: 2024-05-23 00:00:00.000000 UTClocal title:: NMIS Power Electronics Advanced Packaging Semiconductor Facility - Wafer Mount Equipmentgrossbudgetlc: 70000.0type_of_procedure: Otherbidding_response_method: Not Avai

Gt Ref Id - 82151896

Deadline - May 23, 2025

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