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Northwestern Polytechnical University Flip Chip Bonding Machine Open Tender Announcement

西北工业大学 China has Released a tender for Northwestern Polytechnical University Flip Chip Bonding Machine Open Tender Announcement in Infrastructure and construction. The tender was released on Nov 22, 2024.

Country - China

Summary - Northwestern Polytechnical University Flip Chip Bonding Machine Open Tender Announcement

Deadline - Dec 17, 2024

GT reference number - 98095719

Product classification - Construction work

Organization Details:

  Address - China

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 98095719

  Document Type - Tender Notices

Notice Details and Documents:

Description - Description: Goods/Equipment/Mechanical Equipment/Metal Processing Equipment/Metal Welding Equipment,Goods/Equipment/Mechanical Equipment/Metal Processing Equipment/Other Metal Processing Equipmentlocal title:: 西北工业大学倒装焊键合机公 开招标公告local description: : 货物/设备/机械设备/金属加工设备/金属焊接设备,货物/设备/机械设备/金属加工设备/其他金属加工设备Net Budget LC: : 1800000.0Document Fee: : ¥300 est_amount: 1800000.0

Gt Ref Id - 98095719

Deadline - Dec 17, 2024

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