Procurement Of 0664-2340Sumeck67/03 High Precision Inverted Bonding Machine (Solder Bump)(1)

Name: Procurement Of 0664-2340Sumeck67/03 High Precision Inverted Bonding Machine (Solder Bump)(1)
Start: 2023-12-02
End: 2023-12-22
Location: SUMEC INTERNATIONAL TECHNOLOGY CO., LTD.

SUMEC INTERNATIONAL TECHNOLOGY CO., LTD. China has Released a tender for Procurement Of 0664-2340Sumeck67/03 High Precision Inverted Bonding Machine (Solder Bump)(1) in laboratory equipment and services . The tender was released on Dec 02, 2023.

Country - China

Summary - Procurement Of 0664-2340Sumeck67/03 High Precision Inverted Bonding Machine (Solder Bump)(1)

Deadline - login to view

GT reference number - 75295217

Product classification - Laboratory, optical and precision equipments (excl. glasses)

Organization Details:

Address - China

Contact details - 565656565

Tender notice no. - 76454545

GT Ref Id - 75295217

Document Type - Tender Notices

Notice Details and Documents:

Description - 0664-2340SUMECK67/03 - Tender Notice for Procurement Of 0664-2340Sumeck67/03 High Precision Inverted Bonding Machine (Solder Bump)(1). Global Tenders is not only confined to tenders but we also upload crucial information, from future prospects to past market records.

Gt Ref Id - 75295217

Deadline - Dec 22, 2023

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