Procurement Of 1354-234Hxzbg2313 Zhengzhou Xinghang Technology Co., Ltd.Ball Grid Array Package Die Bonder Purchase Project(1)

Name: Procurement Of 1354-234Hxzbg2313 Zhengzhou Xinghang Technology Co., Ltd.Ball Grid Array Package Die Bonder Purchase Project(1)
Start: 2023-05-30
End: 2023-06-20
Location: hengxinzixunguanliyouxiangongsi

hengxinzixunguanliyouxiangongsi China has Released a tender for Procurement Of 1354-234Hxzbg2313 Zhengzhou Xinghang Technology Co., Ltd.Ball Grid Array Package Die Bonder Purchase Project(1) in Machinery and Equipments. The tender was released on May 30, 2023.

Country - China

Summary - Procurement Of 1354-234Hxzbg2313 Zhengzhou Xinghang Technology Co., Ltd.Ball Grid Array Package Die Bonder Purchase Project(1)

Deadline - login to view

GT reference number - 66798742

Product classification - Industrial machinery

Organization Details:

Address - China

Contact details - 565656565

Tender notice no. - 76454545

GT Ref Id - 66798742

Document Type - Tender Notices

Notice Details and Documents:

Description - hengxinzixunguanliyouxiangongsi has released a Invitation for Bids for Procurement Of 1354-234Hxzbg2313 Zhengzhou Xinghang Technology Co., Ltd.Ball Grid Array Package Die Bonder Purchase Project(1). Global Tenders is not only confined to tenders but we also upload crucial information, from future prospects to past market records.

Gt Ref Id - 66798742

Deadline - Jun 20, 2023

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