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Sources Sought Notice For Copper See-Through Wafer For Sem-Based Overlay Metrology

COMMERCE, DEPARTMENT OF United States has Released a tender for Sources Sought Notice For Copper See-Through Wafer For Sem-Based Overlay Metrology in Energy, Power and Electrical. The tender was released on Dec 24, 2024.

Country - United States

Summary - Sources Sought Notice For Copper See-Through Wafer For Sem-Based Overlay Metrology

Deadline - Jan 08, 2025

GT reference number - 100451142

Product classification - Semiconductors

Organization Details:

  Address - United States

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 100451142

  Document Type - Tender Notices

Notice Details and Documents:

Description - Description: The purpose of this sources sought notice is to conduct market research and identify potential sources of commercial products/services that satisfy the Government’s anticipated needs. BACKGROUND The National Institute of Standards and Technology (NIST), Physical Measurement Laboratory (PML), Microsystems and Nanotechnology Division (MND), CHIPS R&D Program (https://www.nist.gov/chips/metrology-community) as part of the CHIPS Act activities, is now developing imaging and measurement solutions for integrated circuit (IC) overlay metrology using a scanning electron microscope (SEM). IC production relies on measurements of the 3D size, shape, and placement of structures with atomi

Gt Ref Id - 100451142

Deadline - Jan 08, 2025

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