Most trusted source for Tendering Opportunities and Business Intelligence since 2002
Most trusted source for Tendering Opportunities and Business Intelligence since 2002
Country - France
Summary - Supply Of Wafer Cutting Equipment Up To 200Mm For The Cea Leti Institute
Deadline - login to view
GT reference number - 96897398
Product classification - Microelectronic machinery and apparatus
Address - France
Contact details - 565656565
Tender notice no. - 76454545
GT Ref Id - 96897398
Document Type - Tender Notices
Description - Description: This consultation relates to the supply of wafer cutting equipment of sizes up to 200mm.local title:: Fourniture d’un équipement de découpe de wafers d’une taille allant jusqu’à 200mm pour l’Institut LETI du CEAContract Durati on: : 4 MONTHContract Type: : Supplylocal description: : La présente consultation est relative à la fourniture d’un équipement de découpe de wafers d’une taille allant jusqu’à 200mm. category: supplies lot_details: 1: Supply of wafer cutting equipment up to 200mm for the CEA LETI Institute
Gt Ref Id - 96897398
Deadline - Nov 29, 2024
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