Supply Of Wafer Cutting Equipment Up To 200Mm For The Cea Leti Institute

Name: Supply Of Wafer Cutting Equipment Up To 200Mm For The Cea Leti Institute
Start: 2024-11-05
End: 2024-11-29
Location: CEA Grenoble

CEA Grenoble France has Released a tender for Supply Of Wafer Cutting Equipment Up To 200Mm For The Cea Leti Institute in Technology Hardware and Equipment. The tender was released on Nov 04, 2024.

Country - France

Summary - Supply Of Wafer Cutting Equipment Up To 200Mm For The Cea Leti Institute

Deadline - login to view

GT reference number - 96917955

Product classification - Microelectronic machinery and apparatus

Organization Details:

Address - France

Contact details - 565656565

Tender notice no. - 76454545

GT Ref Id - 96917955

Document Type - Tender Notices

Notice Details and Documents:

Description - notice_title: Supply Of Wafer Cutting Equipment Up To 200Mm For The Cea Leti Institutelocal title:: Fourniture d’un équipement de découpe de wafers d’une taille allant jusqu’à 200mm pour l’Institut LETI du CEA Global Tenders is not only confined to tenders but we also upload crucial information, from future prospects to past market records.

Gt Ref Id - 96917955

Deadline - Nov 29, 2024

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