Tsinghua University Chiplet Integrated Packaging Design, Electromagnetic Simulation And Channel Parameter Analysis Software Purchase Project Open Tender Announcement

Name: Tsinghua University Chiplet Integrated Packaging Design, Electromagnetic Simulation And Channel Parameter Analysis Software Purchase Project Open Tender Announcement
Start: 2024-12-03
End: 2024-12-24
Location: 清华大学

清华大学 China has Released a tender for Tsinghua University Chiplet Integrated Packaging Design, Electromagnetic Simulation And Channel Parameter Analysis Software Purchase Project Open Tender Announcement in laboratory equipment and services . The tender was released on Dec 02, 2024.

Country - China

Summary - Tsinghua University Chiplet Integrated Packaging Design, Electromagnetic Simulation And Channel Parameter Analysis Software Purchase Project Open Tender Announcement

Deadline - Dec 24, 2024

GT reference number - 98876656

Product classification - Laboratory, optical and precision equipments (excl. glasses)

Organization Details:

Address - China

Contact details - 565656565

Tender notice no. - 76454545

GT Ref Id - 98876656

Document Type - Tender Notices

Notice Details and Documents:

Description - Description: Goods/Equipment/Instruments/Teaching Equipmentlocal title:: 清华大学CHIPlet集成封装设计、电磁仿真及通道参数分析软件购置项目公开招标公告local description: : 货物/设备/仪器仪表/教学仪器Net Budg et LC: : 3190000.0Document Fee: : ￥500 est_amount: 3190000.0

Gt Ref Id - 98876656

Deadline - Dec 24, 2024

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