Wafer Saw

  Address - Germany

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 98026054

  Document Type - Tender Notices

Description - Description: A semi-automatic wafer saw is being advertised, designed for wafers with a diameter of up to 6'' or pieces with an area of ​​up to 220 x 160 mm. The wafer saw should also be designed for high-precision cuts and be used for dividing a nd structuring wafers. It should also be possible to divide a workpiece into pieces of up to 5 x 5 mm and to process entire wafers automatically. The system must be designed to process various materials, including pure Si, LN, and quartz wafers as well as thin-film composites such as thin-film lithium niobate and thin-film silicon as well as III-V materials.It must be possible to retrofit the model with functions such as ultrasonic sawing. The ad

Gt Ref Id - 98026054

Deadline - Dec 11, 2024