Waferbonder (Izm-31) (Pr915379-2590-P)

  Address - Germany

  Contact details - 565656565

  Tender notice no. - 76454545

  GT Ref Id - 104484638

  Document Type - Tender Notices

Description - Description: Description: This one-piece system is used for the high-precision Bonden by Wafern with polymer/metal surfaces or surfaces from different semiconductor materials. It is essential for the integration of heterogeneous materials and compris es two different bond chambers (with the option to upgrade them on four chambers) with the possibility of using defined heat, pressure, vacuum and rinsing gas conditions. The system enables inline wafer cleaning and plasma activation as well as the highly precise wafer-to-wafer orientation and the bonds in fully automatic and semi-automatic recipe-controlled process drains.Optional features:-Substrate handling: software for reading and logging th

Gt Ref Id - 104484638

Deadline - Apr 03, 2025